In recent years, the LED industry has gradually calmed down from the blazing lighting revolution, and the development of China's LED industry has become increasingly mature and rational. The luminous efficacy of light-emitting diodes (LEDs) has also increased dramatically over the past decade, from the past 20 lumens per watt to the recent 150 lumens per watt, and current high-power LEDs have reached the point of being suitable for large-scale general-purpose semiconductor lighting. And semiconductor lighting has such major advantages as energy saving, environmental protection, long-term effect, etc. It is a new generation of lighting source that is worth promoting. LED packaging is the key technology to achieve the above performance, and it is also the key point for the Chinese LED industry to urgently break through.
A few days ago, the reporter learned from the creative era of the organizer of the high-tech fair electronic exhibition, in order to help local LED lighting companies to seek breakthroughs in key technologies, in the lighting revolution to get rid of the gap between the technology gap with Western companies, in the twelfth high-tech fair electronic exhibition During the (ELEXCON2010) period, Professor Li Shizhen from the Hong Kong University of Science and Technology will invite the “High Brightness LED Packaging Workshop†to answer questions and explain the evolution and development trend of the lighting source, and discuss the LED packaging structure in detail. The scope of the lecture includes chip interconnect technology, phosphor coating, plastic packaging process, and heat dissipation materials and thermal management; technical issues related to LED optical design, optical analysis, and optical inspection are also detailed. In addition, this workshop will also discuss the application of high-brightness LED arrays and modules in general and special lighting projects, and analyze related cases. At the end of the course, we will introduce the prospects and technology roadmap for semiconductor lighting and discuss issues related to patents.
The LED industry chain is generally divided into upper, middle and lower reaches, which are LED epitaxial chips, LED packages and LED applications. As the LED packaging industry in the LED industry chain, it plays an indispensable role in the entire industry chain. In the field of LED lighting, which is widely concerned in the industry, advances in packaging technology are particularly important. The difference in packaging technology can directly affect the quality of LED products. Good packaging and heat dissipation technology can make the LED work below 60 °C junction temperature and the lifetime can exceed 50,000 hours. The poor packaging technology will shorten the LED life by more than half.
According to research firm iSuppli, the global LED market sales growth rate is about 14.6% from 2006 to 2012, and the application of emerging areas such as large-size LCD backlights, automotive lighting and general lighting will stimulate LED growth. It is estimated that by 2012, the LED market will reach $12.3 billion. At present, the improvement of chip light efficiency makes the efficiency of some high-efficiency LED street lamps reach 80 lm/W or more, which has the advantage of energy saving, and its reliability and service life need to rely on packaging technology to further improve.
LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great speciality. In general, the die of the discrete device is sealed within the package, and the package functions primarily to protect the die and complete the electrical interconnection. The LED package is to complete the output electrical signal, protect the normal operation of the die, output: visible light function, both electrical parameters, optical design and technical requirements, can not simply use the discrete device package for LED.
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