NFC chip launches micro layout to realize mobile payment / light and thin design

With the two camps of ISIS Alliance and Google pushing mobile payment mechanisms in North America, mobile phones have been launched with the introduction of near-field wireless communication (NFC) function; including NXP, Infineon and STMicroelectronics ( ST) and other chip makers have adopted the 65-nanometer (nm) process to develop a single NFC chip, and are actively engaged in the early market.

However, mobile devices are nearly as demanding for thinner and lighter. Adding an NFC chip will squeeze the printed circuit board (PCB) design space; therefore, some chip manufacturers are the first to introduce an advanced 40-nanometer manufacturing process in the hope of achieving product size and power. In terms of consumption, create a differentiated competitive advantage to gain a seat in the NFC market.

Offering a 40nm NFC Broadcom grabbing mobile payment boom

In order to take advantage of the NFC market and share business opportunities, Broadcom has announced the first NFC chips built with an advanced 40-nanometer process and will be mass-produced in the first quarter of next year, with low power consumption and small size. Establishing product advantages will connect with existing NFC chip suppliers.

Craig Ochikubo, vice president and general manager of Broadcom Wireless Mobile Personal Network Division, said that to assist original design manufacturers (ODMs) and original equipment manufacturers (OEMs) to introduce NFC technology in tablets and smartphones, it is also light, thin and short Design guideline. Broadcom is the first to develop the NFC chipset-BCM2079x using a 40nm complementary metal oxide semiconductor (CMOS) process, which not only saves more than 90% of power consumption, reduces the number of components used by 40%, but also indirectly reduces PCB space by 40% % Is currently the smallest and most power-saving NFC solution on the market.

Therefore, unlike NFC chip manufacturers such as NXP, Infineon, and STMicroelectronics, which have been working in the market for a long time, they still stop at the 65nm process and cannot fully meet the low power consumption performance and accountability of mobile devices. The strict requirements of the bit space, the introduction of 40-nanometer process technology is definitely the key to Broadcom's first-come-and-first access to the NFC market.

Jian Shengfeng, manager and senior director of Broadcom's Taiwan R & D center, revealed that Broadcom has more than 400 employees in the Taiwan R & D center, and plans to recruit 100 more next year to deepen its technological development capabilities.

Jian Shengfeng, manager and senior director of Broadcom Taiwan R & D Center, believes that even if Broadcom is a rising star of NFC chips, after first crossing the 65-nanometer process level, it will quickly open up the market with two advantages of better power saving efficiency and micro size. Breaking ground; and taking advantage of the next year's mobile payment mechanism, one after another, the NFC mobile phone that came out of the trend has come out, and further compete for business opportunities.

It is understood that Broadcom ’s long-lasting business strategy is to acquire and merge innovative companies with technological complementarity. Jian Shengfeng said that the recently launched BCM2079x NFC chipset in addition to Broadcom ’s own ink on NFC technology, the NFC chip manufacturer that was acquired last year. --Innovision also provides important silicon intellectual property (IP) technology, which effectively complements the key design links of this 40nm NFC chip.

On the other hand, focusing on ODM / OEM's emphasis on end-to-end wireless connectivity solutions, BCM2079x can achieve full connectivity with Broadcom's Bluetooth, Wi-Fi and Frequency Modulation (FM) chip modules to facilitate data between different devices Communicate with the film. In addition, through Broadcom's advanced Maestro middleware (Middleware), it can also reduce the complexity of product design and accelerate the time to market.

However, Jian Shengfeng analyzed that consumers are happy to meet the convenience of mobile payment, but returning to the consideration of mobile device design, thinning or thinning is still the same truth. Therefore, in order to support the mobile payment function without increasing the space occupied by the PCB board, Broadcom has already integrated NFC design in the chip module integrating wireless local area network (Wi-Fi) and Bluetooth (Bluetooth). Driven by the trend of thinning and thinning in the future, Broadcom can also hope to win at the starting point, enabling the three compatible chip modules to come out as soon as possible, providing ODM and OEM with comprehensive solutions.

NFC introduces wireless chip module SiP packaging technology on standby

Concerned that the existing NFC chips are all in the form of single chips, it is difficult to meet the increasingly strict requirements of mobile devices, so the trend of integrating NFC chips into Wi-Fi and Bluetooth modules has gradually taken shape. Aiming at this business opportunity, System-in-Package (SiP) technology, which is good at integrating multiple chips, is gaining momentum, and will help the future of miniaturized three-in-one chipsets come out as soon as possible.

Ju Shang RF Senior Associate Liu Sichun pointed out that the advantage of SiP packaging lies in the consideration of both performance and size, and has become the driving force for miniaturization of mobile device components.

Liu Shangchun, Senior Associate of Chip SiP's Radio Frequency (RF) SiP Business Division, said that thanks to the iPad and iPhone, the trend of lightness and thinness has enabled the highly integrated SiP chip packaging technology to play a greater stage. Especially for the future mobile devices that require more functions, but can not ignore the original intention of light and thin, the use of SiP technology to create the smallest size and easy to integrate memory, logic and wireless communication components has become the trend.

For the current hot topic of mobile payment mechanism with NFC function on mobile devices; Liu Shangchun pointed out that the current NFC chip is still in the development stage of a single chip, which is bound to bring more space for PCB design and routing. Therefore, it is estimated that under the consideration of the design of mobile device brands and ODMs, the solution that will drive NFC to be integrated into Wi-Fi + Bluetooth wireless communication chip modules will be paid more and more attention. In this way, it will also bring more benefits to SiP Multiple business opportunities.

Liu Shangchun further analyzed that any type of chip can achieve the benefits of heterogeneous integration through SiP packaging, especially the same type of chip is more necessity to meet the minimum footprint. In other words, NFC, which belongs to the same wireless transmission category, will naturally form a three-in-one chip module with Wi-Fi and Bluetooth after the mobile payment structure is stable and market demand is emerging.

Seeing this trend, Liu Shangchun revealed that Jujing has borrowed years of experience in Wi-Fi / Bluetooth modules to develop NFC-compatible wireless chip module layouts, but will initially focus on customized needs as long as the chip maker or ODM After releasing the relevant orders, Jujing can proceed with customized design schemes to create differentiated competitive advantages for customers.

As for really seeing the three-in-one wireless communication chip module coming out of the cage, Liu Shangchun believes that it will still take some time, because only the North American region is now pushing the mobile payment mechanism. If the chip business imports NFC into the chip module, it will inevitably bear the market Whether the demand is sufficient to amortize the risk of cost.

Therefore, Liu Shangchun predicts that the NFC chip will still be built in the MicroSD card or subscriber identification module (SIM) card initially as a mobile device matching function, and then determine the necessity of integration into a chipset depending on market demand.


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