Soleriq E is available in two versions covering the entire chromatographic range from 2700 K to 6500 K. Even at 85 ° C (close to the application temperature), these two versions of the LED still provide 103 lm / W high luminous efficiency at 4000 K. At the same temperature, a larger version of the Soleriq E 45 achieves a typical brightness of 4000 lm (rated at 880 mA), while a smaller version of the Soleriq E 30 achieves a lumen output of 2700 lm (at 600 mA) .
In the range of 4th-order MacAdam ellipses, Soleriq E's narrow white light group achieves excellent color consistency. In solutions where color consistency is extremely demanding, it can also be based on a 2nd order MacAdam ellipse group. A Soleriq E LED provides plenty of illumination. From then on, only one component needs to be integrated to achieve the brightness that can be achieved with a large number of LEDs in the past, which makes the luminaire design simpler. All chips are mounted under the conversion layer (on-board chip), like a uniform light-emitting surface, which ensures that the light color of the lamp is uniform, the illumination is uniform, and even the light can be easily coupled into the external light-guiding element.
The lights from the Soleriq E LEDs have lower optical losses, making LED bulbs and fixtures more efficient. Therefore, downlights using Soleriq E LEDs as light sources also have the typical advantages of LEDs, such as high energy efficiency, long life, etc., and easier integration of light sources into luminaires.
Do you know what is ENEPIG in PCB?
What is ENEPIG?ENEPIG-Electroless Nickel Electroless Palladium Immersion Gold is a surface finish for Printed Circuit Boards.ENEPIG works well with lead free and conventional eutectic solder alloys.This is the best way for gold wire bonding. Advantages for ENEPIG:
1.[Black Nickel" free – no possibility of grain boundary corrosion of nickel surface by immersion gold
2.Palladium acts as an additional barrier layer to further reduce copper diffusion to surface, thus ensuring good solderability
3.Palladium completely dissolves into solder, without leaving an excessively high P% rich interface, exposing an oxide-free nickel surface allowing reliable formation of Ni/Sn intermetallic
5.Withstands multiple lead-free reflow soldering cycles
6.Demonstrates excellent gold wire bondability
7.Process costs substantially lower than electrolytic nickel gold or electroless nickel electroless gold
ENEPIG PCB,Aluminum PCB,Rigid PCB,Flexible PCB
Storm Circuit Technology Ltd , http://www.stormpcb.com