Study on LED Package Silicone Rubber and Its Bonding Properties

Hydrolysis with methyltrimethoxysilane, dimethyldimethoxysilane with KH560 (3-(2,3-epoxypropoxy)propyltrimethoxysilane, KH570 (γ-(methacryloyloxy)) Propyltrimethoxysilane) and tripropyl borate, etc., adjusting the ratio of the coupling agent and the ratio of the tripropyl borate, and de-alcohol condensation under concentrated hydrochloric acid to obtain a series of tackifiers. The ratio of methyl vinyl MQ silicone resin and the addition amount of tackifier can improve silica gel and PPA (poly-p-phenylene terephthalamide) without affecting the mechanical properties and light transmittance of silicone rubber. Bonding of aluminum-based silver plating layer, and research on transmittance, mechanical properties, red ink penetration resistance, high temperature resistance, thermal shock resistance, application fit and reliability of silicone rubber. Silicone rubber with a hardness of 70 A and a viscosity of about 4000 cs can best meet the mechanical properties of the LED package.

Under the requirement of mechanical properties, the higher the hydrogen content of hydrogen-containing silicone oil, the worse the tear strength after curing of silica gel; the smaller the hydrogen content of hydrogen-containing silicone oil, the better the tear strength after curing of silica gel, but the hydrogen content is too small. Will result in a decrease in the hardness of the silica gel, so it is preferably a hydrogen-containing silicone oil having a hydrogen content of 0.75-0.8%; a methyl vinyl MQ silicone resin having a M/Q = 0.8-1.0 and a solid content of 50% and a vinyl content of 2-3 %, When the viscosity is 5000-7000cs, it can be used with hydrogen-containing silicone oil to obtain a molding liquid silica gel with tensile strength of 7.5 Mpa, elongation at break of 150%, Shore A hardness of 70 A and light transmittance of 96%. , mold top, integrated package, etc., can effectively protect the chip and gold wire, and increase the luminous flux.

Hydrolysis with diphenyldimethoxysilane and methylphenyldimethoxysilane catalyzed by concentrated hydrochloric acid to obtain a methylphenyl prepolymer, followed by removal of water and a part of hydroxyl groups, and KH560 (3-(2) , 3-glycidoxy)propyltrimethoxysilane), KH570 (-(methacryloyloxy)propyltrimethoxysilane), tripropyl borate, etc. are reacted to obtain phenyl high-fold LED package silicon silicon Boron tackifier. By adjusting the ratio of phenyl hydrogen-containing silicone resin to phenyl vinyl silicone resin, as well as the tackifier synthesis process and the amount of tackifier, the silica gel and PPA (polyphenylene terephthalate) are improved under the premise of ensuring the transmittance of silica gel. The adhesion of diphenyl p-phenylenediamine and silver plating layer, and the transmittance, mechanical properties, application fit and packaging reliability of the encapsulated silica gel were investigated. The results show that a high-fold LED package with a hardness of 30 D, a mixed viscosity of 5,500 cs, a refractive index of 1.54, and a light transmittance of 97% can meet the requirements of the LED package for silica gel.

Under the requirement of mechanical properties, the phenyl hydrogen-containing silicone resin is not the larger the hydrogen content, the higher the hydrogen content. The higher the internal stress after curing, the harder it is to pass the thermal shock test, and the hydrogen content is not as small as possible. If the hydrogen content is too small, the hardness of the silica gel is too low. Therefore, a phenyl hydrogen-containing silicone resin having a hydrogen content of 0.25 %, a viscosity of 1200 cs, and a refractive index of 1.54 is preferable. Phenylvinyl silicone resin with a viscosity of 8000-20000 cs, a vinyl content of 5.0-6.0%, a refractive index of 1.54, and a phenyl hydrogen-containing silicone resin, can prepare a mixed viscosity of about 5500 cs, hardness of 30 D, refractive index 1.54, phenyl high-fold LED packaged silica gel with a light transmittance of 97%. It is used for high-quality LED lamp bead packaging, which can greatly protect the chip gold wire and improve the luminous flux of the lamp bead, and improve the anti-vulcanization effect of the outdoor LED lamp.

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