An important link in the international development of TD-LTE is the maturity of chip terminal capabilities. Under the guidance of Qualcomm and STMicroelectronics, Intel, Nvidia, Marvell, HiSilicon and other manufacturers have become outstanding product manufacturers, and they plan to launch multi-mode TD-LTE chips by the end of this year. Sequans, who previously led the industry in 4G WiMAX terminal chips, also recently joined the TD-LTE trial.
It can be seen that TD-LTE has received much more support from international and Chinese chip companies than in the TD-SCDMA era.
Early layout is key
The Secretary-General of the TD Technology Forum, which has many years of experience in the chip field, admitted to the reporter that the development of chips and system equipment is very different. Once the system equipment has the underlying technology, the equipment foundation is laid, and the functions are basically realized, it is away from commercial Not far away, it can be brought to market after improving equipment reliability and further optimizing costs. From the realization of the function to the actual shipment of millions of chips, mass production is required after more than two tape-outs and one year or more of pre-commercial testing and preparation. This is a specific law of the chip industry. It may take longer if you include the debugging of the protocol stack and the physical layer.
Because of this, the international / domestic chip companies currently leading the terminal in the LTE market have already been deployed early.
In the BWA spectrum auction of the Indian government last year, Qualcomm won a 20MHz TDD spectrum at 2.3GHz, and also established an LTE joint venture in India, mainly to conduct 3G and LTE interoperability tests and promote TD-LTE infrastructure, chips Commercial processes of groups and terminals. Also last year, based on Qualcomm's Snapdragon S2 series processor and MDM9600 USB modem, the US Verizon Wireless operator launched the world's first large-scale LTE commercial network in December 2010. This year, based on its MDM9600 3G / LTE multimode chip, Qualcomm and Huawei completed the world's first GSM / WCDMA / TD-LTE interoperability test on the Indian carrier Aircel.
In addition to international chip companies, China ’s Lianxin Technology, Spreadtrum, ZTE, etc. have completed the design and finalization of TD-LTE chips; MediaTek ’s multi-mode TD-LTE (GSM / TD / TD-LTE) overall plan has been completed, and it is expected Production.
It is reported that Qualcomm will also launch a chipset that supports LTE FDD and LTE TDD UE Type 4 mobile broadband standards, which will support 150 Mbit / s downlink peak data transmission rate.
After LTE commercial product form will be further enriched
Fancy LTE chips need to have the characteristics of high integration, multi-mode, cross-operating system, high processing capacity, multimedia performance, low power consumption, combination of software and hardware, etc., which was evaluated by Goldman Sachs as "may lead the multi-mode LTE / 3G chip market â€STMicroelectronics Ericsson also actively acted last year, together with Quanta and Nokia, demonstrated the development of tablets, booklets and other terminals based on their chips. This year ’s product focus is more on LTE multimode chips, following this year 2 Introduced two HSPA + / LTE multimode fiber tuners to the demodulator Thor M7300 (supporting TD-LTE, FDD LTE, HSPA +, TD-SCDMA, EDGE) and Thor M7400 this month. The reference design is sent to the testing session.
Zhang Daijun, president of STMicroelectronics China, said: In the LTE commercial stage, terminal product forms will be further enriched. In addition to smart phones and tablet computers, there will be more demand for the use of M2M.
Q & A: Secretary-General Time of TD Technology Forum
Complex environment increases the difficulty of TD-LTE chips
Commercial products require more than two or three tapes to complete.
The 2G / 3G / 4G hybrid networking mode will last a long time, which requires the terminal chip to support multiple technologies, multiple frequency bands, multiple data rates, and multiple services, greatly increasing the complexity of the chip. In addition, the demand for chip baseband / multimedia / RF integration has become a trend, and terminal prices have continued to fall, increasing the cost pressure on chip links. It can be said that for TD-LTE, the biggest difficulty of the entire industry chain is still in the chip terminal link. Of course, with the joint efforts of many excellent chip companies at home and abroad, the so-called "bottleneck" situation will not be formed again.
Chinese companies themselves have lower manufacturing costs than foreign countries, and it can be said that they have mastered the core technology and patents of TD. Is this beneficial to the output of the entire industrial chain (equipment, terminal, software)?
Time: The Chinese government strongly supports TD-LTE research and development and industrialization, and organizes and coordinates operators and equipment manufacturers to carry out large-scale network trials. This method is not available in other countries. With the support of the government, domestic and foreign enterprises, as well as upstream and downstream of the industrial chain, have formed a situation of close unity and cooperation, which is a very good opportunity to promote the technological maturity and industrialization capabilities of local manufacturers.
In terms of core technology, local companies have done a lot of work in TD-SCDMA R & D and commercial use, and have very obvious advantages in the hybrid networking of TD-LTE and TD-SCDMA and the development of multi-mode terminals. However, in the international market, foreign operators often directly deploy a single TD-LTE network, and the products and solutions of local enterprises are exported to the international market, and they face positive competition with international manufacturers in terms of technology, quality, service, and price. .
International telecommunications giants have launched a complete solution for TD-LTE, including not only the equipment itself, but also software and services. Local manufacturers also need to make continuous efforts in terms of overall solution integration, application software development, and new business support for mobile Internet and Internet of Things.
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