On October 23, TSMC spent 3.21 billion Taiwan dollars to purchase 14.32 hectares of land in Zhunan Science Park as a research and development and early production base for 18-inch wafer and 7-nanometer process. It is estimated that construction will start in 2016 and install in 2017. It is the first semiconductor factory in the world to plan a blueprint for an 18-inch wafer.
The industry believes that TSMC has recently cooperated with Intel and Samsung joint venture lithography equipment manufacturer Esmol (ASML) to accelerate the development of 18-inch wafers and ultra-deep ultraviolet (EUV). This time, it is an extension of advanced process layout.
TSMC's most advanced process technology at this stage is 28 nm. This time, we started to build a 7-nm production blueprint. After 28 nm, the next four generations of technology, with 18-inch wafer production, can make each chip more Lightweight and short, more output per unit wafer, significantly reducing production costs.
The director of TSMC revealed that the purchase of land mainly considers that there is no land available for the construction of the Hsinchu Science Park. In order to cope with the next generation of product technology, TSMC must prepare for the “land inventory†as soon as possible.
TSMC temporarily designated this newly acquired land as the 8th phase of Fab12, and started construction of the plant in 2016 at the earliest. According to industry estimates, after the introduction of 18-inch wafer R&D and trial production in the 8th issue of Fab12, TSMC will introduce mass production at the end of 2017 at the fifth phase of Zhongke 15 Factory.
TSMC will become the world's first semiconductor factory to plan the 18-inch wafer construction blueprint, leading Intel, Samsung, Grofund, UMC and other rivals. TSMC’s capital expenditure this year has risen to 8.5 billion U.S. dollars. Foreign capital is expected to continue to increase its capital expenditures next year. The expansion of advanced process production lines through high capital expenditure is precisely the strategy of TSMC to break open competitors.
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The industry believes that TSMC has recently cooperated with Intel and Samsung joint venture lithography equipment manufacturer Esmol (ASML) to accelerate the development of 18-inch wafers and ultra-deep ultraviolet (EUV). This time, it is an extension of advanced process layout.
TSMC's most advanced process technology at this stage is 28 nm. This time, we started to build a 7-nm production blueprint. After 28 nm, the next four generations of technology, with 18-inch wafer production, can make each chip more Lightweight and short, more output per unit wafer, significantly reducing production costs.
The director of TSMC revealed that the purchase of land mainly considers that there is no land available for the construction of the Hsinchu Science Park. In order to cope with the next generation of product technology, TSMC must prepare for the “land inventory†as soon as possible.
TSMC temporarily designated this newly acquired land as the 8th phase of Fab12, and started construction of the plant in 2016 at the earliest. According to industry estimates, after the introduction of 18-inch wafer R&D and trial production in the 8th issue of Fab12, TSMC will introduce mass production at the end of 2017 at the fifth phase of Zhongke 15 Factory.
TSMC will become the world's first semiconductor factory to plan the 18-inch wafer construction blueprint, leading Intel, Samsung, Grofund, UMC and other rivals. TSMC’s capital expenditure this year has risen to 8.5 billion U.S. dollars. Foreign capital is expected to continue to increase its capital expenditures next year. The expansion of advanced process production lines through high capital expenditure is precisely the strategy of TSMC to break open competitors.
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