At present, with the development of printed circuit boards in the direction of high density and high precision, more stringent requirements are imposed on the sulphate copper plating process, and various factors in the copper plating process must be controlled at the same time to obtain high quality coatings. In the following, the phenomenon of excessive consumption of chloride ions during the copper plating process is analyzed, and the cause of excessive consumption of chloride ions is analyzed.
An antecedent cause of excessive consumption of chloride ions:
When the copper plating occurs, the low current region of the circuit board surface appears "matte" phenomenon, and the chlorine square concentration is low; generally, after adding hydrochloric acid, the "matte" phenomenon of the plating in the low current density region of the plate surface can disappear, and the plating liquid is in the plating solution. The chloride ion concentration can reach the normal range, and the plating of the plate surface is bright. If the "matte" phenomenon of the low current density coating is to be solved by adding a large amount of hydrochloric acid, it is not necessarily caused by the chlorine ion concentration being too low, and the real reason needs to be analyzed. If a large amount of hydrochloric acid is added: one may have other consequences, and secondly, increase production costs, which is not conducive to competition.
Correct analysis of "low current density zone coating dull" reasons:
By adding a large amount of hydrochloric acid to eliminate the phenomenon of "non-brightness in the coating of low current density region", it is indicated that if the chloride ion is too small, hydrochloric acid is added to increase the concentration of chloride ions to a normal range, so that the plating layer in the low current density region is bright. If you want to add doubling of hydrochloric acid to make the concentration of chloride ions reach the normal range? What is consuming a lot of chloride ions? Too high a chloride ion concentration will cause the brightener to consume quickly. It indicates that chloride ions react with brighteners, and excess chloride ions are consumed; in turn, excess brighteners also consume chloride ions. Because the chloride ion is too small and the brightener is excessively caused by the non-brightness of the coating in the low current density region, it can be seen that the main reason for the excessive consumption of chloride ions in the copper plating is that the concentration of the brightener is too high.
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